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High temperature resin 3D printing delivers exceptional thermal stability for demanding engineering applications. iamRapid offers this advanced SLA 3D printing material in India, with a Heat Deflection Temperature (HDT) up to 238°C—ideal for molds, heat-stressed prototypes, and functional components tested under extreme conditions.
High Temp Resin is a specialized photopolymer engineered for high temperature resin 3D printing applications. With an exceptionally high Heat Deflection Temperature (HDT) of up to 238°C at 0.455 MPa, it is suitable for creating parts that must withstand high temperatures without deforming. This high temperature resin is ideal for functional prototypes, injection mold masters, and components used in thermal testing across industries in India. Printed via SLA technology, it maintains excellent dimensional accuracy and surface finish. Order high temperature resin 3D prints in India for your next heat-resistant application.
Key High Temp Resin properties rated to guide you in selecting the best fit for your 3D printing needs.
High Temp Resin is ideal for producing parts that need to withstand high temperatures without deforming. It's suitable for applications such as molds, thermal testing, and functional prototypes exposed to extreme heat.
Provides high thermal stability but is more brittle compared to standard resins. Suitable for parts that need to maintain dimensional accuracy under heat but are not subjected to mechanical stress.
| Property | Value, metric |
|---|---|
| Tensile Strength | Approximately 50 MPa |
| Tensile Modulus | Approximately 3,000 MPa |
| Elongation at Break (%) | 2% |
| Flexural Strength | Approximately 100 MPa |
| Flexural Modulus | Approximately 4,000 MPa |
| Notched Izod Impact Strength | Approximately 16 J/m |
| Shore Hardness | Shore D 88 |
Printing with High Temp Resin may require adjusted exposure settings due to its unique formulation. Post-processing includes thorough cleaning and extended UV curing, sometimes at elevated temperatures, to achieve maximum thermal properties.
| Type | Value |
|---|---|
| Lead Time | 2-5 business days |
| Wall Thickness | Minimum 1.0 mm |
| Tolerance | ±0.1%, minimum ±0.05 mm |
| Max Part Size | Up to 600x 600 x 450 mm |
| Layer Height | - |
Exceptional heat resistance, maintaining dimensional stability at high temperatures.
| Property | Value, metric |
|---|---|
| Heat Deflection Temperature (HDT) | Approximately 238°C at 0.455 MPa |
| Thermal Expansion Coefficient | Approximately 80 x 10^-6 /°C |
| Thermal Expansion (Scale 0-100) | 20 |
| Max Service Temperature | Up to 230°C before significant deformation may occur |
Acts as an electrical insulator; suitable for non-conductive applications.
| Property | Value, metric |
|---|---|
| ESD Safety | Not ESD safe |
| Conductivity | Non-conductive; insulating properties |