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Discover BioMed Resin—a biocompatible photopolymer resin suitable for medical and dental applications requiring sterilizable, safe-to-use components, ideal for surgical guides, medical devices, and custom healthcare solutions.
BioMed Resin is formulated to meet biocompatibility standards for medical and dental applications. It is designed for use in devices and components that require prolonged skin or mucosal membrane contact. The resin offers high strength, wear resistance, and can be sterilized using common methods such as autoclaving or gamma radiation.
Key BioMed Resin properties rated to guide you in selecting the best fit for your 3D printing needs.
BioMed Resin is ideal for producing medical and dental components that require biocompatibility and sterilization. It enables the creation of patient-specific devices and models with high precision and safety standards.
Provides high strength and wear resistance suitable for functional medical and dental components.
Property | Value, metric |
---|---|
Tensile Strength | Approximately 60 MPa |
Tensile Modulus | Approximately 2,500 MPa |
Elongation at Break (%) | 6% |
Flexural Strength | Approximately 100 MPa |
Flexural Modulus | Approximately 2,500 MPa |
Notched Izod Impact Strength | Approximately 25 J/m |
Shore Hardness | Shore D 85 |
Printing with BioMed Resin requires strict adherence to handling and post-processing protocols to maintain biocompatibility. Equipment and workspace cleanliness are critical. Post-processing includes thorough cleaning, UV curing, and sterilization.
Type | Value |
---|---|
Lead Time | 2-5 business days |
Wall Thickness | Minimum 0.5 mm |
Tolerance | ±0.05%, minimum ±0.02 mm |
Max Part Size | Up to 600x 600 x 450 mm |
Layer Height | - |
Moderate heat resistance; suitable for parts that may undergo sterilization processes.
Property | Value, metric |
---|---|
Heat Deflection Temperature (HDT) | Approximately 70°C at 0.455 MPa |
Thermal Expansion Coefficient | Approximately 80 x 10^-6 /°C |
Thermal Expansion (Scale 0-100) | 65 |
Max Service Temperature | Up to 65°C before significant deformation may occur |
Acts as an electrical insulator; suitable for non-conductive applications.
Property | Value, metric |
---|---|
ESD Safety | Not ESD safe |
Conductivity | Non-conductive; exhibits insulating properties. |