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Explore the superior performance of Titanium Ti6Al4V ELI—a high-strength, lightweight titanium alloy for DMLS 3D printing, offering excellent biocompatibility, corrosion resistance, and mechanical properties, ideal for aerospace, medical implants, and high-performance engineering applications.
Ti6Al4V ELI (Extra Low Interstitials) is a high-performance titanium alloy used in DMLS 3D printing. It offers exceptional strength, low weight, and excellent biocompatibility. The ELI grade has reduced levels of impurities, enhancing ductility and fracture toughness. This makes it suitable for critical applications such as medical implants, aerospace components, and high-stress engineering parts.
Key Titanium Ti64ELI properties rated to guide you in selecting the best fit for your 3D printing needs.
Ti6Al4V ELI is ideal for producing high-performance parts requiring exceptional strength-to-weight ratios and biocompatibility. It is widely used in aerospace for critical components and in the medical field for implants and surgical instruments.
Provides high strength, low weight, and good ductility, suitable for critical applications requiring superior performance.
Property | Value, metric |
---|---|
Tensile Strength | Approximately 900-1000MPa |
Tensile Modulus | Approximately 110,000 MPa |
Elongation at Break (%) | 20% |
Flexural Strength | Approximately 70 MPa |
Flexural Modulus | Approximately 1,600 MPa |
Notched Izod Impact Strength | Approximately 3.5 kJ/m^2 |
Shore Hardness | Shore D 75 |
Printing with Ti6Al4V ELI involves DMLS technology, requiring an inert gas environment (typically argon) to prevent oxidation. The process uses a high-power laser to fuse titanium powder layer by layer. Post-processing includes support removal, stress relief annealing, heat treatment, and surface finishing to achieve desired mechanical properties and surface quality.
Type | Value |
---|---|
Lead Time | 7-20 business days |
Wall Thickness | Minimum 0.3 mm |
Tolerance | ±0.1%, minimum ±0.05 mm |
Max Part Size | Up to 250x 250 x 325 mm |
Layer Height | - |
High melting point and good thermal stability make it suitable for high-temperature applications.
Property | Value, metric |
---|---|
Heat Deflection Temperature (HDT) | Approximately 95°C at 0.45 MPa |
Thermal Expansion Coefficient | Approximately 9 x 10^-6 /°C |
Thermal Conductivity | Approximately 6.7 W/m·K |
Max Service Temperature | Up to 400°C for continuous use |
Low electrical conductivity, not typically used for conductive applications.
Property | Value, metric |
---|---|
Dielectric Strength | Approximately 10.15 kV/mm |
Dielectric Constant (1 MHz) | Approximately 2.5 - 3.0 |
Volume Resistivity | Approximately 10^12 Ω·cm |
ESD Safety | Not ESD safe |