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Experience the strength and precision of Rigid Resin—a glass-filled photopolymer resin designed for SLA 3D printing, offering high stiffness and a polished finish, ideal for producing parts that require rigidity, dimensional stability, and resistance to deformation under load.
Rigid Resin is a glass-filled photopolymer resin that provides high stiffness and resistance to deformation. Reinforced with glass particles, it offers a high modulus and polished surface finish. This resin is ideal for producing parts that require rigidity and dimensional stability, such as housings, fixtures, and structural components. It maintains accuracy under load and is less prone to creep compared to standard resins.
Key High Temp Resin properties rated to guide you in selecting the best fit for your 3D printing needs.
Rigid Resin is ideal for producing parts that require high stiffness and dimensional accuracy. It's suitable for engineering applications where parts must maintain their shape under load.
Offers high stiffness and resistance to deformation, suitable for parts that require structural integrity.
Property | Value, metric |
---|---|
Tensile Strength | Approximately 75 MPa |
Tensile Modulus | Approximately 4,000 MPa |
Elongation at Break (%) | 2% |
Flexural Strength | Approximately 120 MPa |
Flexural Modulus | Approximately 4,000 MPa |
Notched Izod Impact Strength | Approximately 25 J/m |
Shore Hardness | Shore D 84 |
Printing with Rigid Resin may require adjusted exposure settings due to its glass content. An all-metal resin tank is recommended to prevent wear. Post-processing includes thorough cleaning and UV curing to achieve maximum mechanical properties.
Type | Value |
---|---|
Lead Time | 2-5 business days |
Wall Thickness | Minimum 0.8 mm |
Tolerance | ±0.1%, minimum ±0.05 mm |
Max Part Size | Up to 600x 600 x 450 mm |
Layer Height | - |
Moderate heat resistance; maintains dimensional stability under moderate temperatures.
Property | Value, metric |
---|---|
Heat Deflection Temperature (HDT) | Approximately 75°C at 0.455 MPa |
Thermal Expansion Coefficient | Approximately 50 x 10^-6 /°C |
Thermal Expansion (Scale 0-100) | 60 |
Max Service Temperature | Up to 70°C before significant deformation may occur |
Acts as an electrical insulator; suitable for non-conductive applications.
Property | Value, metric |
---|---|
ESD Safety | Not ESD safe |
Conductivity | Non-conductive; insulating properties |